ASRock B860M LiveMixer WiFi Motherboard Micro ATX with Intel 1851 Socket

Κωδικός προϊόντος: B860M LiveMixer WiFi

207,77 

7 σε απόθεμα

7 σε απόθεμα


ASRock
EAN: 4711581490314

Αποστολή από συνεργαζόμενο ευρωπαϊκό προμηθευτή.

Περιγραφή

Motherboard for computers with an Intel processor, installed in socket 1851, and DDR5 memory.

Live Mix. Life Max

LiveMixer is designed by today’s generation of content creators who need motherboards with extensive connectivity for streaming and other auxiliary devices. Additionally, its reliable performance allows us to deliver great content and economically manage our time.

Multiple Streaming Devices

Avermedia: We tested many video capture devices with different interfaces to provide the most stable system for content creators.

GC553
GC573
Bu113
GC311
GC570D
GC570

Elgato: We tested many video capture devices with different interfaces to provide the most stable system for content creators.

HD60 S+

Capacitor 20K

The upgraded 20K Black capacitor not only extends the lifespan to 20,000 hours but also increases the capacitance value from 560uF to 1000uF, offering many benefits:

Higher capacitance: Greater charge storage for better support at high loads.
Lower ripple: Reduced power output fluctuations, improving quality.
More stable output current: Steady power supply, minimizing voltage impacts.
Better performance and system stability: Increased reliability and consistent performance.

10+1+1 Power Phase Design

It features durable components and an absolutely smooth power supply to the CPU. Additionally, it offers unparalleled overclocking capabilities and enhanced performance with the lowest temperature for advanced gamers.

Dr. MOS

Dr.MOS is the integrated power stage solution optimized for modern voltage buck-set applications! Compared to traditional discrete MOSFETs, it intelligently provides higher current for each phase, thus offering improved thermal performance and superior performance.

High-Density Power Connector

CPU overclocking requires higher current. ASRock’s Hi-Density Power Connectors are designed to withstand higher currents compared to traditional CPU and ATX power plugs, providing a more stable system and reducing the risk of fire during intense overclocking.

Support for DDR5 XMP & EXPO

ASRock, which originates from the design concept “built for stable and reliable”, makes no compromises on any detail. This motherboard is made with high-quality materials, and enthusiastic users can enjoy boosting DDR5 memory overclocking performance by enabling the pre-tested profiles. Ensure that the memory modules are capable of Intel® XMP/AMD EXPO™ and overclocking can be made so accessible, satisfying, and sweat-free.

PCIe Gen5 Blazing M.2

Blazing M.2 hosts the latest PCI Express 5.0 standard for double the bandwidth compared to the previous generation, with an amazing transfer speed of 128Gb/s, it is ready to unleash the full potential of future ultra-fast SSDs.

M.2 Heatsink Toolless Design

Apart from the tool-free design of the M.2 SSD motherboard, ASRock has taken it up a notch by introducing this industry-first M.2 heatsink quick release mechanism on the motherboard. The user-friendly tool-free design makes the installation of the M.2 SSD extremely easy and straightforward.

M.2 Bottom Heatsink

The M.2 bottom heatsink is capable of effectively dissipating the heat of the M.2 SSD through the motherboard’s board, maximizing performance while maintaining system stability.

Aluminum cooler

The first thing that catches the eye is the optimized design of the aluminum heatsink. Heatsinks are vital for efficient heat dissipation, especially during heavy workloads such as gaming or productivity tasks. Motherboards built with heatsinks can effectively manage thermal performance and, therefore, effortlessly ensure system stability and durability.

Up to 22 USB Ports (front + rear)

Featuring 22 USB ports, this design maximizes connectivity and provides more reliable and stable support for multiple auxiliary devices compared to external USB hubs.

Wi-Fi 6E 802.11axe

WiFi 6E technology has expanded into the entire new 6GHz spectrum band, providing more WiFi capabilities and delivering even better and faster internet traffic. In addition to providing higher speeds, WiFi 6E also enhances lower latency and supports service levels equivalent to 5G networks.

Thunderbolt™ 4 Type-C

Thunderbolt™ 4 technology offers speed and flexibility in the most advanced USB Type-C, providing a fast and simple level of connectivity for work or home. It enables lightning-fast data transfer up to 40Gbps and connects external displays, Thunderbolt™ devices, and USB with a single Thunderbolt 4 cable.

Live Mix. Life Max

LiveMixer is designed by today’s generation of content creators who need motherboards with extensive connectivity for streaming and other auxiliary devices. Additionally, its reliable performance allows us to deliver great content and economically manage our time.

Multiple Streaming Devices

Avermedia: We tested many video capture devices with different interfaces to provide the most stable system for content creators.

GC553
GC573
Bu113
GC311
GC570D
GC570

Elgato: We tested many video capture devices with different interfaces to provide the most stable system for content creators.
HD60 S+

Capacitor 20K

The upgraded 20K Black capacitor not only extends the lifespan to 20,000 hours but also increases the capacitance value from 560uF to 1000uF, offering many benefits:

Higher capacitance: Greater charge storage for better support at high loads.

Lower ripple: Reduced power output fluctuations, improving quality.

More stable output current: Steady power supply, minimizing voltage impacts.

Better performance and system stability: Increased reliability and consistent performance.

10+1+1 Power Phase Design

It features durable components and an absolutely smooth power supply to the CPU. Additionally, it offers unparalleled overclocking capabilities and enhanced performance with the lowest temperature for advanced gamers.

Dr. MOS

Dr.MOS is the integrated power stage solution optimized for modern voltage buck-set applications! Compared to traditional discrete MOSFETs, it intelligently provides higher current for each phase, thus offering improved thermal performance and superior performance.

High-Density Power Connector

CPU overclocking requires higher current. ASRock’s Hi-Density Power Connectors are designed to withstand higher currents compared to traditional CPU and ATX power plugs, providing a more stable system and reducing the risk of fire during intense overclocking.

Support for DDR5 XMP & EXPO

ASRock, which originates from the design concept “built for stable and reliable”, makes no compromises on any detail. This motherboard is made with high-quality materials, and enthusiastic users can enjoy boosting DDR5 memory overclocking performance by enabling the pre-tested profiles. Ensure that the memory modules are capable of Intel® XMP/AMD EXPO™ and overclocking can be made so accessible, satisfying, and sweat-free.

PCIe Gen5 Blazing M.2

Blazing M.2 hosts the latest PCI Express 5.0 standard for double the bandwidth compared to the previous generation, with an amazing transfer speed of 128Gb/s, it is ready to unleash the full potential of future ultra-fast SSDs.

M.2 Heatsink Toolless Design

Apart from the tool-free design of the M.2 SSD motherboard, ASRock has taken it up a notch by introducing this industry-first M.2 heatsink quick release mechanism on the motherboard. The user-friendly tool-free design makes the installation of the M.2 SSD extremely easy and straightforward.

M.2 Bottom Heatsink

The M.2 bottom heatsink is capable of effectively dissipating the heat of the M.2 SSD through the motherboard’s board, maximizing performance while maintaining system stability.

Aluminum cooler

The first thing that catches the eye is the optimized design of the aluminum heatsink. Heatsinks are vital for efficient heat dissipation, especially during heavy workloads such as gaming or productivity tasks. Motherboards built with heatsinks can effectively manage thermal performance and, therefore, effortlessly ensure system stability and durability.

Up to 22 USB Ports (front + rear)

Featuring 22 USB ports, this design maximizes connectivity and provides more reliable and stable support for multiple auxiliary devices compared to external USB hubs.

Wi-Fi 6E 802.11axe

WiFi 6E technology has expanded into the entire new 6GHz spectrum band, providing more WiFi capabilities and delivering even better and faster internet traffic. In addition to providing higher speeds, WiFi 6E also enhances lower latency and supports service levels equivalent to 5G networks.

Thunderbolt™ 4 Type-C

Thunderbolt™ 4 technology offers speed and flexibility in the most advanced USB Type-C, providing a fast and simple level of connectivity for work or home. It enables lightning-fast data transfer up to 40Gbps and connects external displays, Thunderbolt™ devices, and USB with a single Thunderbolt 4 cable.

Product Details

  • Size: Micro ATX
  • Type: Desktop

Processor

  • Supported Processors: Intel
  • Models: Core Ultra 5, Core Ultra 7, Core Ultra 9
  • Supported CPU Generation: Arrow Lake
  • Socket: 1851

Chipset

  • Model: Intel B860

Memory

  • Memory type: DDR5
  • Quantity: 4 DIMM Slots
  • Memory Speeds: 5600, 5800, 6000, 6200, 6400, 6600OC, 6800OC, 7000OC, 7200OC, 7400OC, 7600OC, 7800OC, 8000OC, 8200OC, 8400OC, 8666OC
  • Memory Channels: Dual Channel

Internal Connectors

  • PCI Express x16 5.0: 1 Slot
  • SATA III 6Gb/s: 4 Port
  • M.2 Type: 1 PCIe 5.0 Port, 2 PCIe 4.0 Ports
  • M.2 Slots: 0

External Connectors

  • Rear USB-A outputs: 6 USB 2.0 Ports, 6 USB 3.2 Ports
  • Rear USB-C outputs: 1 Thunderbolt 4 Port
  • Ethernet (LAN): 1
  • Screen Connections: HDMI

Specifications

  • RGB Lighting: No
  • WiFi/Bluetooth: Yes
  • Extra:

Sound

  • Sound Card Channels: 7.1
  • Additional Audio Connections: Optical S/PDIF

Top Specs

  • Memory: 4x DDR5
  • GC553
  • GC573
  • Bu113
  • GC311
  • GC570D
  • GC570
  • HD60 S+
  • Higher capacitance: Greater charge storage for better support at high loads.
  • Lower ripple: Reduced power output fluctuations, improving quality.
  • More stable output current: Steady power supply, minimizing voltage impacts.
  • Better performance and system stability: Increased reliability and consistent performance.
  • GC553
  • GC573
  • Bu113
  • GC311
  • GC570D
  • GC570
  • HD60 S+
  • Higher capacitance: Greater charge storage for better support at high loads.
  • Lower ripple: Reduced power output fluctuations, improving quality.
  • More stable output current: Steady power supply, minimizing voltage impacts.
  • Better performance and system stability: Increased reliability and consistent performance.

Χαρακτηριστικά

Επισκόπηση

Βάρος1,49 κ.
Διαστάσεις26 × 29,5 × 6 cm
Size

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